US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Electronic device including heat pipe surrounding multiple integrated circuits" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,410, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device including heat pipe surrounding multiple integrated circuits" was invented by Youngho Yoon (Suwon-si, South Korea) and Sangchul Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processo...