US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Substrate processing apparatus, substrate processing method, and method of fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,677, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus, substrate processing method, and method of fabricating semiconductor device" was invented by Woo Rim Lee (Suwon-si, South Korea), Myoung Jae Seo (Suwon-si, South Korea), In Hye Jeong (Suwon-si, South Korea) and Sung Gil Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus, a substrate processing method, and a method of fabricating a semiconductor device are provided. The substrate processing method includes providing a process gas, generating a preliminary etchant, which...