US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor package including memory die stack having clock signal shared by lower and upper bytes" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,111, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including memory die stack having clock signal shared by lower and upper bytes" was invented by Youngdo Um (Suwon-si, South Korea), Taeyoung Oh (Suwon-si, South Korea) and Hoseok Seol (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a memory die stack having a clock signal shared by lower and upper bytes. Each of a plurality of memory dies constituting the memory die stack of the semiconductor package includes a first clock circuit configured to generate a read clock signal for a l...