US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor package and package-on-package having different wiring insulating layers surrounding differential signal wiring layers" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,747, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and package-on-package having different wiring insulating layers surrounding differential signal wiring layers" was invented by Juyoun Choi (Suwon-si, South Korea) and Seongho Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes: a lower equipotential plate provided in a lower wiring layer; an upper equipotential plate provided in an upper wiring layer; a pair of differential signal wiring lines provided in a signal wiring layer that is betwe...