US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Method of manufacturing semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,676, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method of manufacturing semiconductor device" was invented by Yurim Kim (Suwon-si, South Korea), Teawon Kim (Suwon-si, South Korea), Seunghee Lee (Suwon-si, South Korea), Seungwoo Jang (Suwon-si, South Korea) and Yongsuk Tak (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device including providing a first precursor on a substrate to adsorb a first element of the first precursor onto a first region of the substrate, providing a second precursor on the substrate to adsorb a second element of th...