US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Chuck assembly, fabrication system therewith, and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,535, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Chuck assembly, fabrication system therewith, and method of fabricating semiconductor device using the same" was invented by Seongha Jeong (Hwaseong-si, South Korea), Kyung-Sun Kim (Suwon-si, South Korea), Dongwan Kim (Suwon-si, South Korea), Donghyeon Na (Hwaseong-si, South Korea), Dougyong Sung (Seoul, South Korea), Myeongsoo Shin (Seoul, South Korea) and Ungyo Jung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic ...