US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "System on chip controlling connection of processing unit to external capacitor to reduce voltage droop and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,989, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"System on chip controlling connection of processing unit to external capacitor to reduce voltage droop and electronic system including the same" was invented by Bongwee Yu (Anyang-si, South Korea), Iksu Lee (Yongin-si, South Korea) and Jaegon Lee (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system on chip includes a processing unit including the first processing circuit and a second processing circuit, a connection circuit configured to form a path connecting one of the first processing circuit and the second processing circui...