US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Sintered body, method of fabricating the same, semiconductor fabricating device, and method of fabricating semiconductor fabricating device" (Japanese, South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,381, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Sintered body, method of fabricating the same, semiconductor fabricating device, and method of fabricating semiconductor fabricating device" was invented by Chang Hwan Kim (Suwon-si, South Korea), Takafumi Noguchi (Yokohama, Japan), Toshihiro Iizuka (Yokohama, Japan) and Kenichi Nagayama (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more o...