ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,034, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor packages" was invented by Chulyong Jang (Anyang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes: forming through-vias extending from a front side of a semiconductor substrate into the substrate; forming, on the front side of the semiconductor substrate, a circuit structure including a wiring structure electrically connected to the through-vias; removing a portion of the semiconductor substrate so that at least a portion of each of the through-vias protrudes to a rear si...