ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,105, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Seunggeol Ryu (Suwon-si, South Korea), Taehwan Kim (Suwon-si, South Korea) and Shle-Ge Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view...