ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,099, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hyunseok Kim (Anyang-si, South Korea), Dahye Lee (Anyang-si, South Korea) and Wanho Park (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a package substrate, a first stack structure disposed on the package substrate, the first stack structure including first semiconductor chips stacked and connected to each other by bonding wires, a second stack structure disposed on the first stack structure, and including second semiconductor chips stacked, the second stack s...