US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Semiconductor device and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,809, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method for manufacturing the same" was invented by Shin Cheol Min (Seoul, South Korea), Keon Yong Cheon (Yongin-si, South Korea), Myung Dong Ko (Hwaseong-si, South Korea), Yong Hee Park (Hwaseong-si, South Korea), Sang Hyeon Lee (Gwangju-si, South Korea), Dong Won Kim (Seongnam-si, South Korea), Woo Seung Shin (Siheung-si, South Korea) and Hyung Suk Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an active pattern with a lower pattern and sheet patterns spaced apart from the...