ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,799, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Multi-pattern semiconductor device and method for fabricating same" was invented by Gi Gwan Park (Suwon-si, South Korea), Jung Gun You (Suwon-si, South Korea) and Sun Jung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device capable of capable of improving element performance and reliability. A semiconductor device includes a lower conductive pattern disposed on a substrate, an upper conductive pattern disposed on the lower conductive pattern, and a first plug pattern disposed between the lower ...