US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Method of predicting characteristic of semiconductor device and computing device performing the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,503, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method of predicting characteristic of semiconductor device and computing device performing the same" was invented by Sola Woo (Gwacheon-si, South Korea), Gwangnae Gil (Yongin-si, South Korea), Seyoung Park (Hwaseong-si, South Korea) and Jonghyun Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "To predict characteristics of a semiconductor device, basic training data corresponding to a combination of input data and simulation result data are generated using a technology computer aided design (TCAD) simulator. The TCAD simulator ...