US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Heat dissipation structure and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,961, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Heat dissipation structure and electronic device including the same" was invented by Hyeran Jung (Suwon-si, South Korea), Seunghoon Kang (Suwon-si, South Korea), Hongki Moon (Suwon-si, South Korea), Jongkil Park (Suwon-si, South Korea) and Seungjoo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion conf...