US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Dielectric material comprising lead compound and method of making the same" (Massachusetts Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,678, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-do, South Korea).

"Dielectric material comprising lead compound and method of making the same" was invented by Valentina Lacivita (Cambridge, Mass.), Yan Wang (Brookline, Mass.) and Jeong-Ju Cho (Lexington, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrode assembly including a first electrode and a dielectric layer on the first electrode. The dielectric layer comprises a lead-containing compound of the formula PbMgV2O7, Pb2Te3O8, PbZnV2O7, Na2PbO2, PbP2O6, PbZnSiO4, Pb2In2Si2O9, Pb6(AsO4)[B(AsO4)4], PbAl2Si2O8, K4PbO3, Pb2TiAs2O9, Pb4O(VO4)2, Rb4PbO3, Pb2V...