US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,619, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus" was invented by Hyun Joo Jeon (Suwon-si, South Korea), Jin Hyuk Choi (Suwon-si, South Korea), Kyu Sang Lee (Suwon-si, South Korea), Myung Ki Song (Suwon-si, South Korea), Ji Ho Uh (Suwon-si, South Korea), Kong Woo Lee (Suwon-si, South Korea), Hyun Soo Chun (Suwon-si, South Korea) and Beom Soo Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer transfer apparatus includes a plate, a first belt unit on a first surfac...