ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,648, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sunggu Kang (Suwon-si, South Korea), Youngdeuk Kim (Suwon-si, South Korea) and Mina Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first semiconductor chip on a first package substrate; a second semiconductor chip on a second package substrate; an interposer between the first semiconductor chip and the second package substrate; and a heat dissipation layer on the interposer, wherein the first and second semiconductor chips are spaced apart from each other...