ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,639, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor devices" was invented by Dayoung Lee (Suwon-si, South Korea), Jun-Woo Lee (Bucheon-si, South Korea) and Sungdong Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower structure including a substrate and a cell structure on the substrate and a plurality of interconnection layers, which are stacked on the lower structure in a first direction extending perpendicular to a top surface of the substrate. An uppermost interconnection layer of the plurality of interconnection layers includ...