US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Method of predicting characteristics of semiconductor device and computing device performing the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,971, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method of predicting characteristics of semiconductor device and computing device performing the same" was invented by Jonghyun Lee (Hwaseong-si, South Korea), Gwangnae Gil (Yongin-si, South Korea), Seyoung Park (Hwaseong-si, South Korea) and Sola Woo (Gwacheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "To predict characteristics of a semiconductor device, basic training data corresponding to a combination of process data, device data and simulation result data are generated using a plurality of compact models. Each compact model genera...