US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Fabricating equipment for semiconductor device and method for fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,261, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Fabricating equipment for semiconductor device and method for fabricating semiconductor device" was invented by Intak Jeon (Seoul, South Korea) and Han Jin Lim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fabricating equipment and method for a semiconductor device is provided. The fabricating equipment comprises a process chamber including an internal space, a substrate support which supports a substrate including a first film and a second film, inside the internal space, a nozzle which is placed on the substrate support and supplie...