US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Chip peeling apparatus and chip peeling method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,583, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip peeling apparatus and chip peeling method" was invented by Tatsuya Ishimoto (Yokohama, Japan), Fumitaka Moroishi (Yokohama, Japan) and Masato Kajinami (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source th...