US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Semiconductor packages having test pads" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,683, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having test pads" was invented by Joongwon Shin (Suwon-si, South Korea), Jongmin Lee (Suwon-si, South Korea), Sungyun Woo (Suwon-si, South Korea), Nara Lee (Suwon-si, South Korea), Yeonjin Lee (Suwon-si, South Korea) and Jimin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, includes: a base chip having a front surface and a back surface opposite to the front surface, the base chip including bump pads, wafer test pads, and package test pads, disposed on the front surface; connection ...