US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Semiconductor package including a metal plate and package-on-package having the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,739, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a metal plate and package-on-package having the same" was invented by Junwoo Park (Suwon-si, South Korea), Yongkwan Lee (Suwon-si, South Korea), Seunghwan Kim (Suwon-si, South Korea), Jungjoo Kim (Suwon-si, South Korea), Jongwan Kim (Suwon-si, South Korea), Taejun Jeon (Suwon-si, South Korea) and Junhyeung Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a support wiring structure, a semiconductor chip on the support wiring structure, a connection structure on the supp...