ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,256, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electronic device having pad structure" was invented by Hansu Cheon (Suwon-si, South Korea) and Youngjae Ko (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a housing; a printed circuit board provided in the housing and including a fastening hole; a pad structure provided on the printed circuit board, the pad structure including: a first pad surrounding at least a portion of the fastening hole; a second pad spaced apart from the first pad in a first direction; and a third pad spaced apart from the first pa...