US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Apparatus and method for configuring sub-slots and transmitting uplink information in wireless communication system" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,294, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Apparatus and method for configuring sub-slots and transmitting uplink information in wireless communication system" was invented by Sungjin Park (Suwon-si, South Korea), Jonghyun Bang (Suwon-si, South Korea), Jeongho Yeo (Suwon-si, South Korea), Hyunseok Ryu (Suwon-si, South Korea) and Jinyoung Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system su...