US Patent Issued to SAMSUNG ELECTRONICS on Dec. 23 for "Interconnect structure to reduce contact resistance, electronic device including the same, and method of manufacturing the interconnect structure" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,074, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Interconnect structure to reduce contact resistance, electronic device including the same, and method of manufacturing the interconnect structure" was invented by Hyeonjin Shin (Suwon-si, South Korea), Sangwon Kim (Seoul, South Korea), Kyung-Eun Byun (Suwon-si, South Korea), Hyunjae Song (Hwaseong-si, South Korea), Keunwook Shin (Yongin-si, South Korea), Eunkyu Lee (Yongin-si, South Korea), Changseok Lee (Gwacheon-si, South Korea), Yeonchoo Cho (Seongnam-si, South Korea) and Taejin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office...