US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Semiconductor devices and methods for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,481, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices and methods for fabricating the same" was invented by Bong Kwan Baek (Suwon-si, South Korea), Jun Hyuk Lim (Suwon-si, South Korea), Jung Hwan Chun (Suwon-si, South Korea), Kyu-Hee Han (Suwon-si, South Korea), Jong Min Baek (Suwon-si, South Korea), Koung Min Ryu (Suwon-si, South Korea), Jung Hoo Shin (Suwon-si, South Korea) and Sang Shin Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices with improved performance and reliability and methods for forming the same are provided. The semiconductor...