US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Semiconductor chip and semiconductor package including bonding layers having alignment marks" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,071, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package including bonding layers having alignment marks" was invented by Hyoeun Kim (Cheonan-si, South Korea), Juhyeon Kim (Cheonan-si, South Korea), Wonil Lee (Hwaseong-si, South Korea) and Youngkun Jee (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first substrate and a first bonding layer disposed on the first substrate, and having a flat first outer surface provided by the first bonding layer; and a second semiconductor ch...