ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,068, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Redistribution substrate having embedded inductor" was invented by So-Young Kim (Suwon-si, South Korea) and Giwon Kim (Changwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are redistribution substrates and semiconductor packages including the same. The semiconductor package comprises a redistribution substrate, a semiconductor chip mounted on the redistribution substrate, and an inductor structure in the redistribution substrate and electrically connected to the semiconductor chip. The inductor structure includes an outer coil pa...