US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Method of manufacturing a semiconductor package including a PCB substrate" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,997, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method of manufacturing a semiconductor package including a PCB substrate" was invented by Bong Su Ko (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package manufacturing method of the disclosure includes providing a PCB substrate that extends in a first direction and a second direction perpendicular to the first direction, forming a solder resist layer on the PCB substrate, partially removing the solder resist layer, thereby forming solder resist patterns, disposing semiconductor chips at opposite sides of each of th...