US Patent Issued to SAMSUNG ELECTRONICS on Dec. 2 for "Integrated circuit devices including a back side power distribution network structure and methods of forming the same" (New York, Virginia Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,491, issued on Dec. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Integrated circuit devices including a back side power distribution network structure and methods of forming the same" was invented by Jongjin Lee (Clifton Park, N.Y.), Tae Sun Kim (Ballston Spa, N.Y.), Wonhyuk Hong (Clifton Park, N.Y.), Seungchan Yun (Waterford, N.Y.) and Kang-ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices and methods of forming the same are provided. The methods may include providing a substrate structure including a substrate, a bottom insulator and a semiconductor region between the substrate an...