US Patent Issued to SAMSUNG ELECTRONICS on Dec. 16 for "Semiconductor package and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,194, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method for fabricating the same" was invented by Young Hun Cheong (Seoul, South Korea), Young Lyong Kim (Anyang-si, South Korea) and Cheol Soo Han (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package with improved reliability. The semiconductor package includes: a plurality of connection terminals on a first surface of the semiconductor device; a protection member on the first surface of the semiconductor device and partially covers side surfaces of the plurality of connec...