ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,189, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kunsang Park (Hwaseong-si, South Korea), Kyuha Lee (Seongnam-si, South Korea), Youngmin Lee (Hwaseong-si, South Korea), Seokho Kim (Hwaseong-si, South Korea), Inyoung Lee (Yongin-si, South Korea), Seokhwan Jeong (Suwon-si, South Korea) and Sungdong Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first structure having a first insulating layer and a first bonding pad penetrating the first insulating layer, and a second structure on the first structure and ...