US Patent Issued to SAMSUNG ELECTRONICS on Dec. 16 for "Electronic device comprising heat emission structure" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,583, issued on Dec. 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device comprising heat emission structure" was invented by Youngwook Kim (Suwon-si, South Korea), Sungwoo Lim (Suwon-si, South Korea), Chankyu Lim (Suwon-si, South Korea), Jonggeun Yoon (Suwon-si, South Korea) and Jiwoo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of t...