US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Solder reflow apparatus and method of manufacturing an electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,664, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Solder reflow apparatus and method of manufacturing an electronic device" was invented by Youngja Kim (Suwon-si, South Korea), Donguk Kwon (Suwon-si, South Korea), Youngmin Lee (Suwon-si, South Korea), Byungkeun Kang (Suwon-si, South Korea), Gongmyeong Kim (Suwon-si, South Korea) and Chaein Moon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a pluralit...