US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package including multiple semiconductor chips" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,809, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including multiple semiconductor chips" was invented by Ikjun Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip structure and a transparent substrate. The semiconductor chip structure includes first and second semiconductor chips. The first semiconductor chip includes a semiconductor substrate including first and second surfaces, a wiring layer, and a through electrode. The first semiconductor chip has a step structure on an edge of the semiconductor chip str...