US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Electronic device case and material layer details of the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. RE50,984, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device case and material layer details of the same" was invented by Yong Wook Hwang (Yongin-si, South Korea), Jin Ho Lee (Anyang-si, South Korea), Young Soo Jang (Yongin-si, South Korea), Jung Hyeon Hwang (Seoul, South Korea) and Chang Youn Hwang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a portable terminal including an electronic device and a case disposed thereon that provides water resistant, dust resistant, and insulation for the electronic device by proper positioning of an aperture of the ...