US Patent Issued to SAMSUNG ELECTRONICS on Aug. 26 for "Semiconductor package including plurality of semiconductor chips and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,998, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including plurality of semiconductor chips and method for manufacturing the same" was invented by Kunsil Lee (Hwaseong-si, South Korea) and Dongkwan Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is disclosed. The semiconductor package includes a base structure, a first semiconductor chip over the base structure, a second semiconductor chip over the first semiconductor chip, an adhesive layer between the first semiconductor chip and the second semiconductor chip, and a molding l...