US Patent Issued to SAMSUNG ELECTRONICS on Aug. 26 for "Interconnect structure and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,975, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Interconnect structure and electronic device including the same" was invented by Keunwook Shin (Yongin-si, South Korea), Junghoo Shin (Seoul, South Korea), Kyung-Eun Byun (Seongnam-si, South Korea) and Hyeonjin Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an interconnect structure and an electronic device including the same. The interconnect structure may include a conductive wiring having a certain pattern, a dielectric layer on side surfaces of the conductive wiring, a capping layer on the conductive wiring, ...