ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,029, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Substrate processing apparatus" was invented by Hyunjae Lee (Suwon-si, South Korea), Hyun Bae Kim (Suwon-si, South Korea), Sang Ki Nam (Suwon-si, South Korea), Hansin Bae (Suwon-si, South Korea) and Junghwan Um (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus including a chamber, a support member inside the chamber, a center bias electrode at an inner center region of the support member, an edge bias electrode at an inner edge region of the support member, a center power supply unit connecte...