US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,240, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same" was invented by Sunchul Kim (Hwaseong-si, South Korea), Yonghyun Kim (Anyang-si, South Korea), Seunghwan Baek (Cheonan-si, South Korea), Minjae Lee (Seoul, South Korea) and Juhyung Lee (Sejong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a semiconductor chip on a package substrate; a lower connection bump on the package substrate; and an interposer substrate on the lower co...