US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package including a plurality of semiconductor chips in a stacked structure" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,228, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a plurality of semiconductor chips in a stacked structure" was invented by Duhyoung Ahn (Suwon-si, South Korea), Minseok Kang (Suwon-si, South Korea) and Sungwook Moon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of external connection terminals electrically coupled to a lower surface of the first semiconductor chip. The first semiconductor chip includes a ...