US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,223, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Jun Yun Kweon (Suwon-si, South Korea) and Yeong Beom Ko (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, first and second dummy chips below the first semiconductor chip, a second semiconductor chip between the first and second dummy chips, a first through via penetrating the second semiconductor chip and electrically connected to the first semiconductor chip, second and third through vias penetrating th...