ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,136, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package and method for manufacturing the same" was invented by Hyunsoo Chung (Suwon-si, South Korea), Dae-Woo Kim (Suwon-si, South Korea), Young Lyong Kim (Suwon-si, South Korea) and Inhyo Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to at least one embodiment may include: a first chiplet and a second chiplet disposed side by side with each other, wherein each of the first chiplet and the second comprises a substrate including an active side and a back side opposite to the ac...