US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,770, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Yongjin Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a base chip including a substrate, an upper protective layer disposed on the substrate, an upper pad disposed on the upper protective layer, and a groove disposed adjacent to the upper pad and in which the upper protective layer is recessed; a semiconductor chip including a connection pad disposed on the upper pad, the semiconductor chip being mounted on the base chip; a bump disposed on the upper pad, ...