US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Non-destructive inspection method including inspecting multiple observation sites and method of manufacturing semiconductor memory device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,832, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Non-destructive inspection method including inspecting multiple observation sites and method of manufacturing semiconductor memory device using the same" was invented by Donghyun Lee (Suwon-si, South Korea), Sungyoon Ryu (Suwon-si, South Korea), Sooseok Lee (Suwon-si, South Korea) and Younghoon Sohn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inspection method is provided. The inspection method includes inspecting a plurality of first observation sites by detecting ultrasonic signals emitted from the plurality of first observat...