US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Integrated circuit devices and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,727, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Integrated circuit devices and methods of manufacturing the same" was invented by Dongkwan Yang (Seoul, South Korea), Jaybok Choi (Yongin-si, South Korea) and Yongseok Ahn (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes: a plurality of bit lines extending on a substrate in a first direction parallel to an upper surface of the substrate; a plurality of insulation capping structures respectively arranged on the plurality of bit lines, extending in the first direction, and including a first insulating m...