US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Wiring substrate and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,945, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wiring substrate and semiconductor package including the same" was invented by Youngbae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate may include a core portion, an upper peripheral portion on a top surface of the core portion, and a lower peripheral portion on a bottom surface of the core portion. The upper peripheral portion may include a bridge chip provided on the top surface of the core portion, upper insulating patterns provided on the top surface of the core portion to cover the bridge chip, and upper i...