US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor packages" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,946, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages" was invented by Junghoon Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprising: a first redistribution substrate; a module structure on the first redistribution substrate; a first molding layer on the first redistribution substrate and extending around the module structure; a second redistribution substrate on the module structure and the first molding layer; and a first vertical connection structure on a side of the module structure and electrically connecting the first redist...